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Brand Name : HSTECH
Model Number : HS-700
Certification : CE
Place of Origin : China
MOQ : 1 set
Price : Negotiable
Payment Terms : T/T, Western Union, MoneyGram
Supply Ability : 100 sets per month
Delivery Time : 7~9 work days
Packaging Details : Wooden package
Product Name : Mobile Phone BGA Rework Station
Warranty : 1 Year
Control : Touch screen
PLC : MITSUBISHI
Relay Brand : Schneider
Optoelectronic Switch : OMRON
Material : Aluminum Alloy
Condition : New
Thickness : 0.3 - 5mm
Signal : SMEMA
Application : Electronic Assembly
Color : Silver
Control System : PLC
OEM/ODM : Available
Total power : 2600W
Power Supply : AC220V
Air Pressure : 4-6bar
Mounting accuracy : ±0.01mm
Type : Automatic
Weight : 30KG
High Precision Stepping Motor CCD Color Align System for Mobile Phone BGA Reworking
Introduction
BGA rework station is divided into optical alignment and non-optical alignment, optical alignment through the optical module using a split prism imaging; non-optical alignment is through the naked eye will be BGA according to the PCB board silkscreen line and point alignment, in order to achieve the alignment rework.
Specification
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
BGA Rework Workstation (BGA Rework Station) is the welding equipment for repairing BGA packages.BGA Repair Workstation is generally divided into automatic and manual, by locating different sizes of BGA originals, welding and dismantling intelligent operation of the equipment can effectively improve the productivity of the repair rate and greatly reduce costs.
About Packaging
COMPANY PROFILE
Shenzhen Hansome Technology Co.,Ltd(HSTECH)is a professional professional SMT board handlingequipment(Loader,Unloader, Buffer, Conveyor,etc)manufacturer, We are a high-tech enterprise with independent intellectual propertyrights,the company is mainly engaged in the research and development, productionand sales of sMT/THT production line board handling equipment.We have professional technicians & sales,relies on high-tech and tries our best tosupply high efficient and reliable board handling to our customers. At the same time,our experienced engineering team always grasps smart factory's developing directionupdates the products and technical according to the market demand, pursuit to makemore automation and cost-effective product all the time, we also do the OEM basedon different needs of our customer.
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High Precision Stepping Motor CCD Color Align System for Mobile Phone BGA Reworking Images |